Labtech Microwave offers a comprehensive build-to-print microwave module and microwave components
manufacturing service, which includes DFM support. Our microwave MIC production facility is housed in a
class 10,000 clean room and accommodates ceramic thin film circuit manufacture, laser drilling, laser welding,
automatic chip placement and wire bond assembly. Dedicated microwave components manufacturing is undertaken
within production cells established to meet specific customer or product requirements. In addition,
Labtech Microwave has extensive microwave alignment and microwave testing facilities, which ensures we can
provide a complete turnkey microwave assembly solution.
Labtech – Broadband Microwave Components MIC Assembly
| Manufacturing capabilities | Alignment, test and quality |
|---|---|
| MIC Assembly: | Measurements: |
| Automatic chip and wire assembly | Gain level and ripple |
| Deep access wirebonding | Noise figure |
| Wedge-wedge wirebonding | Input and output return loss |
| Ball-wedge wirebonding | Output power at 1dB gain compression |
| Gold tapes for DC and RF connections | Performance over temperature |
| Eutectic attach of ceramic circuit to carrier | Harmonics |
| Eutectic attach of high power devices | Vector measurements |
| Soft substrate and alumina assembly | Leak testing - fine and gross |
| Thin film manufacturing | Environmental testing and conditioning: |
| Laser lid welding | Mechanical shock |
| In-house RF machining and box build | Mil-std vibration |
| In-house microwave PCB manufacture | Temperature cycling |
| In-house painting facility | Extended burn-in at elevated temperatures |
| PCB and SMD assembly | In accordance with mil-std 883 |
| Quality and environment: | |
| ISO9001:2000 | |
| ISO14001 |